Compile Data Set for Download or QSAR
Report error Found 12 Enz. Inhib. hit(s) with all data for entry = 8152
LigandChemical structure of BindingDB Monomer ID 234880BDBM234880(US9359337, 11)
Affinity DataIC50: 151nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent

LigandChemical structure of BindingDB Monomer ID 234877BDBM234877(US9359337, 8)
Affinity DataIC50: 193nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent

LigandChemical structure of BindingDB Monomer ID 234878BDBM234878(US9359337, 9)
Affinity DataIC50: 226nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent

LigandChemical structure of BindingDB Monomer ID 234871BDBM234871(US9359337, 2)
Affinity DataIC50: 233nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent

LigandChemical structure of BindingDB Monomer ID 234874BDBM234874(US9359337, 5)
Affinity DataIC50: 307nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent

LigandChemical structure of BindingDB Monomer ID 234881BDBM234881(US9359337, 12)
Affinity DataIC50: 385nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent

LigandChemical structure of BindingDB Monomer ID 234873BDBM234873(US9359337, 4)
Affinity DataIC50: 425nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent

LigandChemical structure of BindingDB Monomer ID 234870BDBM234870(US9359337, 1)
Affinity DataIC50: 494nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent

LigandChemical structure of BindingDB Monomer ID 234875BDBM234875(US9359337, 6)
Affinity DataIC50: 504nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent

LigandChemical structure of BindingDB Monomer ID 234872BDBM234872(US9359337, 3)
Affinity DataIC50: 634nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent

LigandChemical structure of BindingDB Monomer ID 234879BDBM234879(US9359337, 10)
Affinity DataIC50: 1.31E+3nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent

LigandChemical structure of BindingDB Monomer ID 234876BDBM234876(US9359337, 7)
Affinity DataIC50: 1.52E+3nMT: 2°CAssay Description:Compound plates were resuspended with 100 ul of HBSS/20 mM HEPES/0.005% BSA buffer (Compound Buffer): column 1A-H: buffer/DMSO (bk); column 2A-H: AP-...More data for this Ligand-Target Pair
In Depth
Date in BDB:
6/26/2017
Entry Details
US Patent